HSPA+ 模块 华为MU709S-2 模块 Mini PCIe

HSPA+ 模块 华为MU709S-2 模块 Mini PCIe

型号︰MU709S-2

品牌︰华为

原产地︰中国

单价︰CNY ¥ 135 / 件

最少订量︰5 件

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产品描述

General Features
• UMTS/HSPA: 900/2100MHz
• GSM/GPRS/EDGE: 850/ 900/ 1800/ 1900 MHz
• Output Power
 UMTS: +24dBm (Power Class 3)
 GSM850 Class 4 (2 W)
 GSM900 Class 4 (2 W)
 GSM1800 Class 1 (1 W)
 GSM1900 Class 1 (1 W)
• Sensitivity
 GSM 850/900 MHz: -110 dBm
 GSM 1800/1900 MHz: -109 dBm
 WCDMA 900 MHz: -112 dBm
 WCDMA 2100 MHz: -111 dBm
• AT commands
 3GPP TS 27.007 and 27.005
 extended AT command
• Power supply: 3.0 V to 3.6V (typical: 3.3V)
• Temperature range: -40° C to 70° C
• Humidity: 5% - 95%
• Dimensions: 30.4 mm x 51 mm x 3.4mm
• Weight: approx. 12g
• USB driver for Linux/Android 

Voice
• DTMF support*
• PCM voice support
• Voice codec: AMR (all rates)

Data
• HSPA: UL 5.76 (Mbps)/ DL (21.6 Mbps)
• WCDMA PS: UL (384 kbps)/ DL (384 kbps)
• EDGE: UL (236.8 kbps)/ DL (236.8 kbps)
• GPRS: UL (85.6 kbps)/ DL (85.6 kbps)

SMS
• MO / MT
• Text / PDU mode

Additional Features
• FOTA
•STK (SIM Took Kit)
• Firmware udate via USB
• Embedded TCP/IP stack

Supplementary Service
• Call forwarding / hold / waiting
• USSD

Interfaces
• 3 Antenna connectors
• PCIE interfaces
• USB 2.0 High speed
• PCM Voice
• SIM Interface (1.8V / 3.0V)
• Power supply
• Reset

Approvals & Certifications
• CCC
• CE
•GCF 

*) features will be ready in future version, test sample would not be available for this features. 

Note:
Please refer to the latest version of Hardware Guide about the specifications. reserves the right to make changes or improvements to any to the products without prior notice. 

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